ICT, Semiconductor & Electronics

Performance now comes from how chips are combined. Five lessons on platforms, process choice, packaging, open interconnects and Asia Pacific from the chipmakers moving first.

HBM has become a strategic AI component. Five lessons on generation leadership, yield, capacity, co-design and Asia Pacific from the memory makers moving first.

AI racks have outgrown air cooling. Five lessons on hybrid design, direct-to-chip liquid, prefabrication and service from the suppliers moving first.

AI clusters turned the optical transceiver into a bottleneck component. Five lessons on silicon photonics, supply, power and the move to 1.6T from the leaders.

Private 5G is moving from pilots to production infrastructure in plants, mines and ports. Five lessons from the operators, vendors and enterprises moving first.

Deep learning, edge compute and a broadening automation wave are turning machine vision from a quality tool into the decision layer of operations. Five lessons from the vendors and enterprises moving first.

A minority of enterprises are scaling AI agents into production while most are still piloting. Five lessons from the vendors and enterprises moving first on outcomes, security, governance and the operating model.